Precision Lapped and Polished Polymers

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Precision Lapped and Polished Polymers

Polished and lapped polymer substrates and polymer wafers for numerous medical, thin film, semiconductor and MEMS applications are now available from Valley Design. Some wafers are available from stock.

  • Polymer wafers for InGaP thin-film microdisk resonators
  • Temporary bonding for two-stage transfer of thin films from one substrate to another
  • Polymer microfluidic device fabrication
  • Polymer electrical and optical input-output interconnects

For innovative engineering, prototyping and manufacturing solutions, Valley Design offers lapping, polishing and precision sizing of all polymer wafers and substrates with no size or thickness limitations.

Return to Home Page: Polyimide applications and polyimide properties

Updated: 22 Jan 2009

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