Polymer wafers and polymer substrates

Precision Lapped and Polished Polymers

Polished and lapped polymer substrates and polymer wafers for numerous medical, thin film, semiconductor and MEMS applications are now available from Valley Design. Some wafers are available from stock.

Polymer wafers for InGaP thin-film microdisk resonators
Temporary bonding for two-stage transfer of thin films from one substrate to another
Polymer microfluidic device fabriaction
Polymer electrical and optical input-output interconnects

For innovative engineering, prototyping and manufacturing solutions, Valley Design offers lapping, polishing and precision sizing of all polymer wafers and substrates with no size or thickness limitations.

Return to Home Page: Polyimide applications and properties

laser drilled holes planarizing polyimide polymer polishing solar cells wafers substrates

VALLEY DESIGN NEWS

Sales and Customer Service	Site Map	Corporate Headquarters
Valley Design West		Valley Design East
151-D Harvey West Blvd.		Two Shaker Road, Bldg. E-001
Santa Cruz, CA 95060	Affilliate Sites	Shirley, MA 01464
West E-mail: west@polyimide-substrates.com		East E-mail: east@polyimide-substrates.com
Germany Sales: germany@valleydesign.com		Germany Sales: germany@valleydesign.com
Phone: 831.420.0595		Phone: 978.425.3030
Fax: 831.420.0592		Fax: 978.425.3031

Return to top of page		Last updated: 7 December 2007
© 2007 Valley Design Corp. All Rights Reserved