Polyimide Substrates, Polyimide Applications and Polyimide Properties

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Unfilled Polyimide Wafers and Polyimide Substrates

polyimide wafer image

Polyimide Wafer

Polyimide wafers, substrates, and precise polyimide shapes are now available from Valley Design. Ultra-thin, ground, lapped or polished pure unfilled polyimide is ideal for thin films, solar cell substrates, multilayer substrates, MEMS microstructures and packaging applications.

Why Polyimide?

  • Low dielectric constant
  • Flexible
  • Polishable to Angstrom level surface finishes
  • Excellent dimensional stability
  • Low water absorption
  • High temperature stability
  • Excellent machinability
  • Low outgassing and non-contaminating
  • Exceptional mechanical strength
  • Low coefficient of thermal expansion

Polyimide wafers polished on one side with 5nm Ra surface finish available from stock:

PART # THICKNESS DIAMETER
PI - P1 - Ø2X020 0.020" 2"
PI - P1 - Ø3X020 0.020" 3"
PI - P1 - Ø100XØ500 500 µm 100 mm
PI - P1 - Ø150XØ500 500 µm 150 mm

Valley Design's special polyimide processing capabilities:

  • Ultra-thin wafers to 50 micrometers
  • Tight thickness tolerances
  • Double side polishing
  • Complex shapes
  • Small diameter holes
  • Precision dicing
  • Large geometry polishing capability

Please call or email for a quotation to meet your requirements.

Valley Design Corp. manufactures polished polyimide wafers under license from Opticomp Networks US Patents No. 6, 563, 998 and 6, 807, 328.

Updated: 14 June 2012